Stack Mold System Combines Fast Injection With High Process Repeatability
NPE2024: Primarily designed for thin-wall packaging applications, the patent-pending mold design by Oerlikon HRSflow brings consistency, simplified maintenance and assembly and a sustainable materials focus.
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Source: Oerlikon HRSflow
Oerlikon HRSflow has developed a patent-pending compact stack mold system that targets thin-wall packaging applications. It is equipped with nozzles from the company’s new Xd series, engineered to withstand high filling pressures. The stack mold system fits a maximum plate thickness of 220 mm. It is designed for fast injection and cycle times via a stable process with high part-to part weight consistency.
The , with a plug-n-play system, enables a simplified assembly. It also offers fast and friendly maintenance, avoiding long and costly production line stoppage. The mold was also conceived to easily process PCR and sustainable compounds.
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